Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
V IN
V FB , V EN
V SW
V OUT
ESD
T J
T STG
T L
Parameter
Voltage on VIN Pin
Voltage on FB and EN Pins
Voltage on SW Pin
Voltage on VOUT Pin
Electrostatic Discharge Protection Level
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Human Body Model per
JESD22-A114
Charged Device Model
per JESD22-C101
Min.
–0.3
–0.3
–0.3
–0.3
–40
–65
3.3
2.0
Max.
6.0
V IN + 0.3
25
25
+150
+150
+260
Units
V
V
V
V
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
V OUT Voltage
Symbol
V IN
V OUT
I OUT
T A
T J
Parameter
V IN Supply Voltage
(1)
V OUT Load Current
Ambient Temperature
Junction Temperature
Conditions
500mW Maximum Output Power
Min.
2.7
6.2
5
–40
–40
Max.
5.5
24.0
25
+85
+125
Units
V
V
mA
°C
°C
Note:
1. Application should guarantee that minimum and maximum duty-cycle should fall between 20-85% to meet the specified
range.
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
T J(max) at a given ambient temperate T A .
Symbol
θ JA
Parameter
Junction-to-Ambient Thermal Resistance
Typical
70
Units
°C/W
? 2009 Fairchild Semiconductor Corporation
FAN5343 ? Rev. 1.0.4
4
www.fairchildsemi.com
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